Title:
THIN FILM PATTERNING ARRANGEMENT
Document Type and Number:
WIPO Patent Application WO2005007418
Kind Code:
A3
Abstract:
A thin film patterning arrangement (6), comprising a substrate (1) and barriers (3) arranged to partition a surface of the substrate (1) into sub-areas(5) is disclosed. Said surface is of a polymeric material, and is coated with an at least partly inorganic coating (2). Thin film material (4) is preferably deposited on said thin film patterning arrangement (6).
Inventors:
DUINEVELD PAULUS C (NL)
SLIKKERVEER PETER J (NL)
SLIKKERVEER PETER J (NL)
Application Number:
PCT/IB2004/051170
Publication Date:
May 12, 2005
Filing Date:
July 08, 2004
Export Citation:
Assignee:
KONINKL PHILIPS ELECTRONICS NV (NL)
DUINEVELD PAULUS C (NL)
SLIKKERVEER PETER J (NL)
DUINEVELD PAULUS C (NL)
SLIKKERVEER PETER J (NL)
International Classes:
B41M3/00; B41M5/52; G02B5/20; (IPC1-7): B41M5/00; G02F1/1335; B41M5/00; B41M3/00; G02B5/20
Foreign References:
| US20020041926A1 | 2002-04-11 |
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