THREE-DIMENSIONAL MOLDED COMPONENT PRODUCTION METHOD AND THREE-DIMENSIONAL MOLDED COMPONENT

WIPO Patent Application WO/2016/208092

A1

Provided is a three-dimensional molded component production method comprising: a three-dimensional molded product preparation step in which a three-dimensional molded product comprising a wiring pattern formed on the surface of a resin substrate is prepared; a protective film preparation step in which a flat protective film that comprises an adhesive and a resin film having a breaking elongation of 50% or more is prepared; an opening formation step in which an opening corresponding to an area in which the wiring pattern is to be exposed is formed in the flat protective film; a three-dimensional molding step in which the flat protective film is three-dimensionally molded so as to correspond to a formation surface of the wiring pattern of the three-dimensional molded product that has been three-dimensionally molded; and a covering step in which the opening is made to face the area in which the wiring pattern is to be exposed while the adhesive is attached to the formation surface of the wiring pattern of the three-dimensional molded product and the three-dimensional molded product is covered with the protective film. In the opening formation step, the position, shape, and size of the opening are designed with consideration to the shape of the resin substrate during patterning of the wiring pattern.

MICHIWAKI SHIGERU (JP)
TAKAGI TSUYOSHI (JP)

PCT/JP2015/084957

December 29, 2016

December 14, 2015

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MEIKO ELECTRONICS CO LTD (JP)

H05K3/28; H05K1/02; H05K1/09; H05K3/22

WO2014168220A1	2014-10-16
WO2015037511A1	2015-03-19

JP2004281248A	2004-10-07
JP2005183484A	2005-07-07
JP2006269496A	2006-10-05

NAGATO, KANJI (JP)
Nagato 侃 2 (JP)

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