Title:
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL WIRING BOARD, AND SUBSTRATE FOR THREE-DIMENSIONAL WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2016/208090
Kind Code:
A1
Abstract:
Provided is a three-dimensional wiring board production method comprising: a preparation step in which a resin film (1) having a breaking elongation of 50% or more is prepared; a first metal film formation step in which a first metal film (3) is formed on the surface of the resin film; a pattern formation step in which the first metal film is subjected to patterning in order to form a desired pattern; a three-dimensional molding step in which three-dimensional molding is performed by heating and pressurizing the resin film; and a second metal film formation step in which a second metal film (21) is formed on the first metal film having a pattern formed thereon. In the first metal film formation step, metal is deposited as particles in order to form the first metal film in a porous state.
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Inventors:
MICHIWAKI SHIGERU (JP)
Application Number:
PCT/JP2015/080796
Publication Date:
December 29, 2016
Filing Date:
October 30, 2015
Export Citation:
Assignee:
MEIKO ELECTRONICS CO LTD (JP)
International Classes:
H05K3/22; H05K1/02; H05K1/09
Domestic Patent References:
| WO2014168220A1 | 2014-10-16 | |||
| WO2015037511A1 | 2015-03-19 | |||
| WO2013132930A1 | 2013-09-12 |
Attorney, Agent or Firm:
NAGATO, KANJI (JP)
Nagato δΎƒ 2 (JP)
Nagato δΎƒ 2 (JP)
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