Title:
TOUGHENED EPOXY RESIN FORMULATIONS
Document Type and Number:
WIPO Patent Application WO/2011/063327
Kind Code:
A3
Abstract:
A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers.
Inventors:
POTISEK STEPHANIE L (US)
WILSON MARK B (US)
WILSON MARK B (US)
Application Number:
PCT/US2010/057606
Publication Date:
August 18, 2011
Filing Date:
November 22, 2010
Export Citation:
Assignee:
DOW GLOBAL TECHNOLOGIES LLC (US)
POTISEK STEPHANIE L (US)
WILSON MARK B (US)
POTISEK STEPHANIE L (US)
WILSON MARK B (US)
International Classes:
C08G59/22; C08L63/00
Domestic Patent References:
| WO2008077141A1 | 2008-06-26 | |||
| WO2010043538A2 | 2010-04-22 |
Foreign References:
| US20090107632A1 | 2009-04-30 | |||
| US20070004871A1 | 2007-01-04 | |||
| DE1227659B | 1966-10-27 | |||
| US2924580A | 1960-02-09 |
Attorney, Agent or Firm:
PRIETO, Joe, R. (Intellectual PropertyP. O. Box 196, Midland MI, US)
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