Title:
TRANSPARENT LED CHIP PACKAGE AND LED LIGHTING INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2012/081875
Kind Code:
A1
Abstract:
The present invention relates to a LED chip package, which is made from a transparent material and comprises a first concave portion at the center of the upper surface in which the LED chip is seated. According to the above configuration, the present invention can provide a LED light bulb which provides a wide light source in an LED that can irradiate in 360 degrees and can effectively dissipate heat that is generated from the LED to the outside.
Inventors:
KIM YOUNG CHUL (KR)
Application Number:
PCT/KR2011/009547
Publication Date:
June 21, 2012
Filing Date:
December 12, 2011
Export Citation:
Assignee:
SONIX JAPAN INC (JP)
KIM YOUNG CHUL (KR)
KIM YOUNG CHUL (KR)
International Classes:
F21S2/00; H01L33/48; F21Y101/02
Foreign References:
| KR20090002206A | 2009-01-09 | |||
| JP2008533716A | 2008-08-21 | |||
| KR20070043330A | 2007-04-25 | |||
| JP4142080B2 | 2008-08-27 |
Attorney, Agent or Firm:
OH, Jong Il (KR)
오종일 (KR)
오종일 (KR)
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