Title:
TREATED SURFACE COPPER FOIL, COPPER FOIL WITH CARRIER AS WELL AS METHODS FOR MANUFACTURING COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/179416
Kind Code:
A1
Abstract:
Provided is a treated surface copper foil that, when used in SAP, is able to impart to a laminate body a surface profile that is not only excellent in plated circuit adhesiveness but also in etchability with respect to electroless copper plating and in dry film resolution. Said treated surface copper foil has a treated surface on at least one side. For the treated surface, the arithmetic mean peak curvature Spc of the ridge peaks measured in accordance with ISO 25178 is at least 55 mm-1. When a resin film is thermocompression-bonded on the treated surface, the surface profile of the treated surface is transferred to the surface of the resin film and the treated surface copper foil is removed by etching, the arithmetic mean peak curvature Spc of the ridge peaks on the remaining resin film surface measured in accordance with ISO 25178 is at least 55 mm-1.
Inventors:
KATO TSUBASA (JP)
MATSUDA MITSUYOSHI (JP)
IIDA HIROTO (JP)
YOSHIKAWA KAZUHIRO (JP)
MATSUDA MITSUYOSHI (JP)
IIDA HIROTO (JP)
YOSHIKAWA KAZUHIRO (JP)
Application Number:
PCT/JP2017/012678
Publication Date:
October 19, 2017
Filing Date:
March 28, 2017
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
C25D7/06; B32B15/04; C25D5/16; C25D21/12; H05K1/09; H05K3/38
Domestic Patent References:
| WO2014133164A1 | 2014-09-04 | |||
| WO2013146088A1 | 2013-10-03 | |||
| WO2017018232A1 | 2017-02-02 | |||
| WO2017006739A1 | 2017-01-12 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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