Title:
UNIFORM TEMPERATURE HEAT-DISSIPATION APPARATUS FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/028099
Kind Code:
A1
Abstract:
Disclosed is a uniform temperature heat-dissipation apparatus for an electronic device. The uniform temperature heat-dissipation apparatus comprises a housing unit and a substrate unit. The housing unit has an air inlet and an air outlet arranged opposite to each other along a first direction; the substrate unit is provided in the housing unit, and has a first surface and a second surface which extend from the air inlet to the air outlet; a first distance is formed between a first end of the substrate unit close to the air inlet, and the air inlet, so that a first uniform flow area is formed between the first end of the substrate unit and the air inlet.
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Inventors:
CHEN QIAN (CN)
WU YUEFENG (CN)
LIU FANGYU (CN)
YANG ZUOXING (CN)
WU YUEFENG (CN)
LIU FANGYU (CN)
YANG ZUOXING (CN)
Application Number:
PCT/CN2021/099294
Publication Date:
February 10, 2022
Filing Date:
June 10, 2021
Export Citation:
Assignee:
SHENZHEN MICROBT ELECTRONICS TECH CO LTD (CN)
International Classes:
H01L23/467; H05K7/20
Foreign References:
| CN111867338A | 2020-10-30 | |||
| CN108550561A | 2018-09-18 | |||
| CN207830218U | 2018-09-07 | |||
| CN107239120A | 2017-10-10 | |||
| CN204090406U | 2015-01-07 | |||
| KR20070010943A | 2007-01-24 | |||
| US8154871B2 | 2012-04-10 |
Attorney, Agent or Firm:
DEQI INTELLECTUAL PROPERTY LAW CORPORATION (CN)
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