Title:
VAPOR DEPOSITION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/074331
Kind Code:
A1
Abstract:
This vapor deposition device (1) has a mask holding unit (2) which holds a deposition mask (7) formed from a metal material, a substrate arrangement unit (3) which arranges the substrate (11) such that the substrate (11) contacts the upper surface of the deposition mask (7), a deposition source (4) and a coil (5) arranged below the deposition mask (7), an AC power supply (PU1) which passes an AC current to the coil (5), and a control unit (SP1) which controls operation of the AC power supply (PU1). The control unit (CP1) generates an AC magnetic field (MF1) in the coil (5) by the AC power supply (PU1) passing an AC current to the coil (5), generates an overcurrent in the deposition mask (7) by applying the AC magnetic field (MF1) to the deposition mask (7), and controls operation of the AC power supply (PU1) so as to cause the deposition mask (7) to rise and adhere to the substrate (11).
Inventors:
ZHANG PENG (JP)
FURUYAMA KOICHI (JP)
FURUYAMA KOICHI (JP)
Application Number:
PCT/JP2022/037741
Publication Date:
May 04, 2023
Filing Date:
October 07, 2022
Export Citation:
Assignee:
JILIN OLED JAPAN RES INSTITUTE CO (JP)
International Classes:
C23C14/04; C23C14/24; H05B33/10; H10K50/00
Foreign References:
| JP2000282219A | 2000-10-10 | |||
| JP2021011607A | 2021-02-04 | |||
| JP2010086809A | 2010-04-15 |
Attorney, Agent or Firm:
HIGUCHI, Takamitsu (JP)
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