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Title:
VASCULAR SAP FLOW RATE SENSOR, VASCULAR SAP FLOW RATE MEASURING DEVICE, AND VASCULAR SAP FLOW RATE MEASURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/074362
Kind Code:
A1
Abstract:
Provided are a vascular sap flow rate sensor, a vascular sap flow rate measuring device, and a vascular sap flow rate measuring method that cause little mechanical or thermal damage to a plant. A vascular sap flow rate sensor (1) includes, as a probe that pierces the plant, only a heater-attached temperature probe (20) provided with a first temperature sensor (21) and a heater (22). The vascular sap flow rate measuring device includes: the vascular sap flow rate sensor (1); a power source for supplying power intermittently to the heater (22); and a calculating unit for obtaining a vascular sap flow rate on the basis of a rising temperature of vascular sap resulting from heating by the heater (22), said rising temperature being measured by the first temperature sensor (21). Since the only probe that pierces the plant is the heater-attached temperature probe (20), mechanical damage to the plant can be reduced. Since the heating by the heater (22) is intermittent, thermal damage to the plant can be reduced.

Inventors:
SHIMOKAWA FUSAO (JP)
INO FUMIYA (JP)
Application Number:
PCT/JP2022/037981
Publication Date:
May 04, 2023
Filing Date:
October 12, 2022
Export Citation:
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Assignee:
UNIV KAGAWA NAT UNIV CORP (JP)
International Classes:
G01F1/684; G01N27/02; G01N27/22
Domestic Patent References:
WO2021070913A12021-04-15
WO2022039007A12022-02-24
Foreign References:
KR20190110685A2019-10-01
JP2010266324A2010-11-25
KR20190102722A2019-09-04
Attorney, Agent or Firm:
YAMAUCHI PATENT ATTORNEYS (JP)
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