Title:
VISCOUS FLUID COATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/129034
Kind Code:
A1
Abstract:
Solder is accommodated in a flow tank (20). The solder is discharged from a nozzle (22) by a pump provided in the flow tank (20). A jetting motor (26) for driving the pump is provided on the exterior of the flow tank (20). A cooling device (30) is provided between the flow tank (20) and the jetting motor (26). The cooling device (30) includes a zigzag-shaped cooling pipe (52). Nitrogen gas is supplied from the upstream end part of the cooling pipe (52), channeled along the cooling pipe (52), discharged from the downstream end part, and fed to the flow tank (20). Release of heat by the jetting motor (26) raises the temperature of the nitrogen gas and lowers the temperature of the jetting motor (26). Heat from the jetting motor (26) is transmitted to the nitrogen gas, and the jetting motor (26) can be satisfactorily cooled.
More Like This:
| WO/2022/039006 | SOLDERING SYSTEM AND SOLDERING METHOD |
Inventors:
ISHIKAWA NOBUYUKI (JP)
TANAKA KATSUNORI (JP)
NISHIBORI MITSUHIRO (JP)
TANAKA KATSUNORI (JP)
NISHIBORI MITSUHIRO (JP)
Application Number:
PCT/JP2014/055105
Publication Date:
September 03, 2015
Filing Date:
February 28, 2014
Export Citation:
Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B23K1/08; H05K3/34; B23K3/06; B23K31/02
Foreign References:
| JP2008109034A | 2008-05-08 | |||
| JPH0421644Y2 | 1992-05-18 | |||
| JPH11307926A | 1999-11-05 |
Other References:
See also references of EP 3113587A4
Attorney, Agent or Firm:
CHUBU PATENT OFFICE (JP)
Central patent business corporation international patent firm (JP)
Central patent business corporation international patent firm (JP)
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