Title:
WAFER SUPPORT
Document Type and Number:
WIPO Patent Application WO/2023/013211
Kind Code:
A1
Abstract:
A wafer support 10 is provided with a substrate 14 formed from a machinable ceramic, a protective layer 16 covering a surface of the substrate, and conductive members 18, 20 at least partially embedded in the substrate. The protective layer 16 is formed from a material that is less likely to corrode due to plasma than the substrate 14.
Inventors:
YAMAGISHI WATARU (JP)
MORI KAZUMASA (JP)
KOUNO HITOSHI (JP)
ETO SHUNICHI (JP)
MORI KAZUMASA (JP)
KOUNO HITOSHI (JP)
ETO SHUNICHI (JP)
Application Number:
PCT/JP2022/021407
Publication Date:
February 09, 2023
Filing Date:
May 25, 2022
Export Citation:
Assignee:
FERROTEC MATERIAL TECH CORPORATION (JP)
International Classes:
C04B41/87; C04B35/488; C04B35/5835; C04B35/596; H01L21/683
Foreign References:
| JP2020155571A | 2020-09-24 | |||
| JP2006045059A | 2006-02-16 | |||
| JP2019194495A | 2019-11-07 | |||
| JP2020155571A | 2020-09-24 |
Attorney, Agent or Firm:
OZAWA Ichiro (JP)
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