Title:
WELL PLATE
Document Type and Number:
WIPO Patent Application WO/2022/091424
Kind Code:
A1
Abstract:
Provided is a well plate in which a well is disposed with superior positional accuracy on a base material on which a conductive pattern and an electrode are formed, and which can reduce the cost thereof while suppressing elution of a material component from a constituent material in comparison with the case in which the base material and a resin layer are adhered by an adhesive. This well plate comprises: a base material composed of a synthetic resin material; an external connection terminal for electrically connecting a conductive pattern disposed on the base material, an electrode formed continuous with one end of the conductive pattern, and an external element which is electrically joined to the conductive pattern and is provided outside the base material; and a resin layer which forms a recess section for holding a liquid while contacting the electrode, is integrated with the base material, and covers the base material.
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Inventors:
SUGIMOTO MASAAKI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)
Application Number:
PCT/JP2020/041133
Publication Date:
May 05, 2022
Filing Date:
November 02, 2020
Export Citation:
Assignee:
ELEPHANTECH INC (JP)
TAKAHATA PREC CO LTD (JP)
TAKAHATA PREC CO LTD (JP)
International Classes:
G01N27/327; G01N27/28
Domestic Patent References:
| WO2006132250A1 | 2006-12-14 | |||
| WO2005001018A1 | 2005-01-06 | |||
| WO2016047561A1 | 2016-03-31 |
Foreign References:
| JP2015187607A | 2015-10-29 | |||
| JP2011220826A | 2011-11-04 | |||
| JP2007171134A | 2007-07-05 | |||
| JP2010032501A | 2010-02-12 | |||
| JP2016517601A | 2016-06-16 | |||
| JP2006015068A | 2006-01-19 | |||
| JP2007010431A | 2007-01-18 | |||
| JP2015090270A | 2015-05-11 |
Attorney, Agent or Firm:
SEZAKI Yukinori (JP)
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