Title:
WIRING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2019/230334
Kind Code:
A1
Abstract:
This wiring circuit board is provided with a plurality of wiring lines which are arranged in parallel to each other, while being at a distance from each other. Each one of the plurality of wiring lines is provided with: an insulating part; a wiring part which is arranged on one surface of the insulating part in the thickness direction; and a support part which is arranged on the other surface of the insulating part in the thickness direction, while being formed of a metal material, and which is configured such that the ratio of the length T in the thickness direction to the length W of the plurality of wiring lines in the parallel arrangement direction, namely T/W is 2 or more.
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Inventors:
SHIBATA NAOKI (JP)
SASAOKA RYOSUKE (JP)
OYABU YASUNARI (JP)
SASAOKA RYOSUKE (JP)
OYABU YASUNARI (JP)
Application Number:
PCT/JP2019/018713
Publication Date:
December 05, 2019
Filing Date:
May 10, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H05K1/05; H05K1/02
Foreign References:
| JP2014191845A | 2014-10-06 | |||
| JP2003321796A | 2003-11-14 | |||
| JP2015232639A | 2015-12-24 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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