Title:
WIRING SUBSTRATE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2015/015746
Kind Code:
A1
Abstract:
Provided are: a wiring substrate for preventing a negative electrical effect caused by an end surface of a wire conductor used for plating and exposed on a side surface of the wiring substrate, and definitively preventing a negative effect caused by EMI noise between the inside and outside of the substrate body; and a method for producing same. A wiring substrate (1a) containing: a substrate body (2) comprising an insulating material, and having a surface (3) and a rear surface (4) which are rectangular when seen from a planar view, and quadrilateral side surfaces (5a, 5b) positioned between these surfaces; and a wire conductor (8) used for plating and having an end surface thereof exposed on one of the side surfaces (5a, 5b) of the substrate body (2). The wiring substrate (1a) is further equipped with: a first insulating layer (11) formed so as to cover the end surface of the wire conductor (8) used for plating on the side surface (5a, 5b) on which the end surface of the wire conductor (8) used for plating is exposed, of the side surfaces (5a, 5b) of the substrate body (2); and on the side surface (5a, 5b) of the substrate body (2) on which the first insulating layer (11) is formed, a conductive layer (12) formed in the side-surface direction of the side surface (5a, 5b) containing the surface of the first insulating layer (11). Furthermore, the conductive layer (12) is electrically connected to a ground layer (10) formed inside the substrate body (2).
Inventors:
TSUNEMI DAIKI (JP)
MORITA MASAHITO (JP)
KITO NAOKI (JP)
IKAWA TATSUHARU (JP)
KODAMA HIROYUKI (JP)
MORITA MASAHITO (JP)
KITO NAOKI (JP)
IKAWA TATSUHARU (JP)
KODAMA HIROYUKI (JP)
Application Number:
PCT/JP2014/003806
Publication Date:
February 05, 2015
Filing Date:
July 17, 2014
Export Citation:
Assignee:
NGK SPARK PLUG CO (JP)
International Classes:
H05K1/02; H01L23/12; H05K1/11; H05K3/40; H05K3/46
Domestic Patent References:
| WO2007060784A1 | 2007-05-31 |
Foreign References:
| JPH11251492A | 1999-09-17 | |||
| JP2001093944A | 2001-04-06 | |||
| JPH07235776A | 1995-09-05 | |||
| JPH02224398A | 1990-09-06 | |||
| JP2517302B2 | 1996-07-24 | |||
| JPH01102987A | 1989-04-20 | |||
| JP2008141412A | 2008-06-19 |
Other References:
See also references of EP 3030054A4
Attorney, Agent or Firm:
AOKI, Noboru et al. (JP)
Aoki 昇 (JP)
Aoki 昇 (JP)
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