Title:
【発明の名称】構成部品を接続する方法
Document Type and Number:
Japanese Patent JP2003520447
Kind Code:
A
Abstract:
A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.
Inventors:
Edvard Kervesten
Guerlain Steme
Frank Nicklaus
Guerlain Steme
Frank Nicklaus
Application Number:
JP2001553579A
Publication Date:
July 02, 2003
Filing Date:
January 17, 2001
Export Citation:
Assignee:
Edvard Kervesten
Guerlain Steme
Frank Nicklaus
Guerlain Steme
Frank Nicklaus
International Classes:
G01J1/02; H01L21/20; H01L21/60; H01L21/68; H01L21/98; H01L27/14; H01L37/00; G01J5/02; H01L25/16; (IPC1-7): H01L37/00; G01J1/02; H01L27/14
Domestic Patent References:
| JPH09210769A | 1997-08-15 | |||
| JPH04170077A | 1992-06-17 |
Foreign References:
| US5557120A | 1996-09-17 | |||
| US5959340A | 1999-09-28 |
Attorney, Agent or Firm:
Kazuo Shamoto (5 outside)