Title:
半導体デバイス及び支持基板の製造方法並びに前記方法によって得られる半導体デバイス
Document Type and Number:
Japanese Patent JP2004507111
Kind Code:
A
Abstract:
A method of manufacturing a semiconductor device in which a semiconductor element, such as a diode, is attached to a support plate and provided with a plastic encapsulation. The plate is provided with a flange which is provided with an undercut region in order to improve the connection between the plate and the encapsulation. The plate is made from a ductile material. A step is formed in the surface of the plate by pressing using a first die, and by pressing using a second die, the flange provided with the undercut region is formed at, or near, the wall of the step. The flange should be formed at, or very close to, the wall of the step in the plate.
Inventors:
Mast Boom Johannes G.P.
Linden Hovius Callian H
Vuguts Adrinus Jay M
Linden Hovius Callian H
Vuguts Adrinus Jay M
Application Number:
JP2002521359A
Publication Date:
March 04, 2004
Filing Date:
August 10, 2001
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
H01L21/48; H01L23/13; H01L23/28; H01L23/495; (IPC1-7): H01L23/28
Attorney, Agent or Firm:
Susumu Tsugaru
Akihiko Miyazaki
Hiroyoshi Aoki
Akihiko Miyazaki
Hiroyoshi Aoki