Title:
ミクロ電子基板から導電物質を電気的、機械的および/または化学的に除去する方法および装置
Document Type and Number:
Japanese Patent JP2004531649
Kind Code:
A
Abstract:
A microelectronic substrate and method for removing conductive material from a microelectronic substrate. In one embodiment, the microelectronic substrate includes a conductive or semiconductive material with a recess having an initially sharp corner at the surface of the conductive material. The corner can be blunted or rounded, for example, by applying a voltage to an electrode in fluid communication with an electrolytic fluid disposed adjacent to the corner. Electrical current flowing through the corner from the electrode can oxidize the conductive material at the corner, and the oxidized material can be removed with a chemical etch process.
More Like This:
Inventors:
Lee wonchi
Mycle Scott G
Moore Scott E
Doan Trang Tea
Mycle Scott G
Moore Scott E
Doan Trang Tea
Application Number:
JP2003507878A
Publication Date:
October 14, 2004
Filing Date:
June 20, 2002
Export Citation:
Assignee:
MICRON TECHNOLOGY,INCORPORATED
International Classes:
C25F3/14; B24B37/04; H01L21/3063; H01L21/3205; H01L21/321; H01L21/3213; H01L21/76; H01L21/762; (IPC1-7): C25F3/14; H01L21/3205
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Shishido Kaichi
Village shrine Atsuo
Disciple Maru Ken
Ino Sato
Fumiaki Otsuka
Shishido Kaichi
Village shrine Atsuo
Disciple Maru Ken
Ino Sato