Title:
基板を研磨するための方法及び組成物
Document Type and Number:
Japanese Patent JP2005518670
Kind Code:
A
Abstract:
Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.
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Inventors:
Ryu, Feng, Cue.
Tsai, Stan, Dee.
Foo, yonky
Neo, Shoe, S.
One, Yang
Dubst, Allen
Chen, Liang-you
Tsai, Stan, Dee.
Foo, yonky
Neo, Shoe, S.
One, Yang
Dubst, Allen
Chen, Liang-you
Application Number:
JP2003571365A
Publication Date:
June 23, 2005
Filing Date:
February 26, 2003
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B24B37/00; B23H5/08; C09G1/02; C09K3/14; H01L21/304; H01L21/321; H01L21/3213; (IPC1-7): H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada