Title:
処理従順な金属間化合物スパッタリングターゲットの製造方法
Document Type and Number:
Japanese Patent JP2005529239
Kind Code:
A
Abstract:
Sputtering targets are produced which have an intermetallic stoichiometry which makes them ductile enough for maching and sputtering. The targets are produced from elemental or alloy powders or alloys, at least one of which is of very fine particle size, e.g., -400 mesh. The elemental or alloy powders are blended, canned, subjected to hot isostatic pressing at low temperatures and high pressures, formed into a billet, and machined to form the target.
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Inventors:
Sandrin, Michael
Kunkel, Bernd
Chan, Willie
Corno, Philip
Kunkel, Bernd
Chan, Willie
Corno, Philip
Application Number:
JP2004511577A
Publication Date:
September 29, 2005
Filing Date:
May 29, 2003
Export Citation:
Assignee:
HERAEUS,INC.
International Classes:
B22F3/15; B22F3/16; C22C1/04; C23C14/34; (IPC1-7): C23C14/34; B22F3/15; C22C1/04
Attorney, Agent or Firm:
Tomijio Sasashima
Haruyuki Nishiyama
Moriaki Ogawa
Haruyuki Nishiyama
Moriaki Ogawa