Title:
ケーシングのないモジュール上に直接に形成された自立コンタクト構造体
Document Type and Number:
Japanese Patent JP2006519475
Kind Code:
A
Abstract:
A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.
Inventors:
Karl Weitner
Eckhart Wolfgang
Jörg Tzapf
Eckhart Wolfgang
Jörg Tzapf
Application Number:
JP2005518520A
Publication Date:
August 24, 2006
Filing Date:
January 15, 2004
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
H01L21/60; H01L21/68; H01L23/482
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel