Title:
オーミックコンタクトを介在させて形成することによって2つのプレートをシールするための方法
Document Type and Number:
Japanese Patent JP2007535133
Kind Code:
A
Abstract:
Bonding of two plates (2, 12) of semiconductor materials, comprises: (a) implantation of metal species (4) in at least the first plate; (b) assembly of the first and second plates, by molecular adherence; (c) formation of metal compounds, alloyed between the implanted metal species and the semiconductor materials of the two plates. An independent claim is also claimed for the structure obtained by this method.
Inventors:
Stefan Poka
Hubert Morisoux
Jean-Francois Michaud
Hubert Morisoux
Jean-Francois Michaud
Application Number:
JP2006546283A
Publication Date:
November 29, 2007
Filing Date:
December 21, 2004
Export Citation:
Assignee:
COMPAGNIE GENERALE DES MATIERES NUCLEAIRES
International Classes:
H01L21/02; H01L21/18; H01L21/265; H01L27/12; H01L21/266
Domestic Patent References:
| JP2002507058A | 2002-03-05 | |||
| JPH11103034A | 1999-04-13 | |||
| JPH10223552A | 1998-08-21 | |||
| JPH07221023A | 1995-08-18 | |||
| JPH02170528A | 1990-07-02 | |||
| JPH01199469A | 1989-08-10 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro