Title:
電子部品の製造方法および電子部品用母基板
Document Type and Number:
Japanese Patent JP2008182251
Kind Code:
A5
Application Number:
JP2008029571
Publication Date:
September 18, 2008
Export Citation:
International Classes:
H05K9/00; H05K3/00
Previous Patent: FABRICATION PROCESS OF SEMICONDUCTOR DEVICE
Next Patent: METHOD OF CONNECTING INTEGRALLY JUXTAPOSED PELTIER/SEEBECK ELEMENT CHIPS
Next Patent: METHOD OF CONNECTING INTEGRALLY JUXTAPOSED PELTIER/SEEBECK ELEMENT CHIPS