Title:
銅表面を処理するための組成物およびその方法
Document Type and Number:
Japanese Patent JP2010538167
Kind Code:
A
Abstract:
The present invention is directed to compositions for copper passivation and methods of use of such compositions.
Inventors:
Catherine E. Razwich
David Maloney
David Maloney
Application Number:
JP2010524048A
Publication Date:
December 09, 2010
Filing Date:
September 08, 2008
Export Citation:
Assignee:
E.K.C.Technology Inc.
International Classes:
C23C22/52
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe