SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

Document Type and Number:

Japanese Patent JP2018037479

Kind Code:

A

Abstract:

PROBLEM TO BE SOLVED: To miniaturize a chip size of a CIS using an organic photoelectric conversion film.SOLUTION: The solid-state imaging device which is a first side face of this technology includes: laminated first and second substrate; a first organic photoelectric conversion film formed on the first substrate. On the second substrate, a latch circuit is formed. This technology can be applied to, for example, a rear face irradiation type CIS.SELECTED DRAWING: Figure 1

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Inventors:

MATSUMOTO AKIRA
TAYANAKA HIROSHI

Application Number:

JP2016167591A

Publication Date:

March 08, 2018

Filing Date:

August 30, 2016

Export Citation:

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Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP

International Classes:

H01L27/146; H01L27/14; H04N5/369; H04N5/374; H04N9/07

Attorney, Agent or Firm:

Takashi Nishikawa
Yoshio Inamoto

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