Title:
ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2018125530
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To increase a current that can be supplied to an electronic element mounted on the top surface of a semiconductor package.SOLUTION: An electronic device 700 includes a semiconductor chip 5, a package 1 for housing the semiconductor chip 5, a plurality of terminals 2 electrically connected to the semiconductor chip 5 and each including a first part on which the semiconductor chip 5 is placed and which is exposed at the center side of a first surface of the rectangle of the package 1 and a second part that extends from the first part on the first side of the first surface or the second side opposite to the first side and which is narrower than the first part, and a plurality of copper posts 3 that penetrate from the first surface of the package 1 to the second surface opposite to the first surface, in which the cross section area in the direction of the first surface is larger than the area of the plurality of terminals 2 on the first surface, and that are provided on a third side and a fourth side that are sides orthogonal to the first side for the semiconductor chip 1 and function as lands for mounting electronic components.SELECTED DRAWING: Figure 10
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Inventors:
SATO SHINYA
YASUDA YUKI
SHIINA YOJIRO
YASUDA YUKI
SHIINA YOJIRO
Application Number:
JP2018010378A
Publication Date:
August 09, 2018
Filing Date:
January 25, 2018
Export Citation:
Assignee:
KATO DENKI SEISAKUSHO KK
TOREX SEMICONDUCTOR LTD
TOREX SEMICONDUCTOR LTD
International Classes:
H01L25/10; H01L23/29; H01L23/31; H01L23/50; H01L25/04; H01L25/07; H01L25/11; H01L25/18
Domestic Patent References:
| JP2005252018A | 2005-09-15 | |||
| JPH11233683A | 1999-08-27 |
Attorney, Agent or Firm:
Izumidori
Mochizuki Yoshitoki
Mochizuki Yoshitoki