Title:
PROTECTIVE MATERIAL FOR ELECTRONIC CIRCUIT, SEALANT FOR PROTECTIVE MATERIAL FOR ELECTRONIC CIRCUIT, SEALING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018174277
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: an electronic circuit protective material which enables the formation of a sealing structure superior in heat dissipation property; a sealant for an electronic circuit protective material, which is used together with the electronic circuit protective material; a sealing method arranged to use the electronic circuit protective material and the sealant for an electronic circuit protective material in combination; and a method for manufacturing a semiconductor device superior in heat dissipation property.SOLUTION: An electronic circuit protective material comprises a resin component, and an inorganic filler; the content of the inorganic filler is 50 mass% or more to a total quantity of the electronic circuit protective material.SELECTED DRAWING: Figure 1
Inventors:
HORI HIROSHI
KANG DONG-CHEOL
YAMAURA ITARU
ISHIBASHI KENTA
KANG DONG-CHEOL
YAMAURA ITARU
ISHIBASHI KENTA
Application Number:
JP2017072893A
Publication Date:
November 08, 2018
Filing Date:
March 31, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L23/29; H01L21/56; H01L23/31
Domestic Patent References:
| JPH10120878A | 1998-05-12 | |||
| JPH10261741A | 1998-09-29 | |||
| JPH0272656A | 1990-03-12 | |||
| JP2017072894A | 2017-04-13 | |||
| JPH1067883A | 1998-03-10 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office
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