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Title:
SOLVENTLESS TYPE ADHESIVE, LAMINATE FILM AND PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP2018197310
Kind Code:
A
Abstract:
To provide a solventless type adhesive, a polyisocyanate composition used therein, and a laminate film obtained by laminating a substrate film with the adhesive, which can develop excellent laminate strength while securing a pot-life and can maintain the pot life of, in particular, the adhesive and polyisocyanate and polyol that are raw materials thereof and laminate strength before and after heat treatment.SOLUTION: A solventless type adhesive including as essential components: a polyisocyanate composition (X) that has an aromatic vinyl/maleic acid anhydride copolymer (B) that is a copolymer of polyisocyanate (A), aromatic vinyl and maleic acid anhydride, has a molar ratio of the raw material monomers (aromatic vinyl/maleic acid anhydride) of 1.5/1 to 5/1 as an essential component; and polyol (Y) that contains 0.3 to 1.0 mass% of water. There are also provided a laminate film and a package using the solventless type adhesive.SELECTED DRAWING: None

Inventors:
OHARA SHINICHI
KIMURA RYUJI
NAKANE KOHEI
SUZUKI SHINYA
Application Number:
JP2017102645A
Publication Date:
December 13, 2018
Filing Date:
May 24, 2017
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C09J175/04; B32B7/12; B32B27/30; B32B27/40; B65D65/40; C08G18/40; C09J135/06
Domestic Patent References:
JP2004027194A2004-01-29
JP2015117328A2015-06-25
JPH05179222A1993-07-20
JP2015124335A2015-07-06
JPH07197005A1995-08-01
JP2001106760A2001-04-17
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Makoto Negishi