Title:
CERAMIC SUBSTRATE
Document Type and Number:
Japanese Patent JP2019079835
Kind Code:
A
Abstract:
To provide a ceramic substrate capable of mounting electronic components accurately, electrically and reliably above multiple via conductors, even if the multiple via conductors are disposed relatively densely at a center side of a front surface of a ceramic substrate body.SOLUTION: A ceramic substrate 1 includes a substrate body 2 being obtained by laminating ceramic layers c1-c3, and having a rectangular configuration in a plan view and a front surface 3 and a rear surface 4 facing each other, and a mounting region 5 located at a center side of the surface 3 of the substrate body 2 in the plan view, and having multiple via conductors 7 disposed in the thickness direction of the substrate body 2. On the surface 3 of the substrate body 2, multiple dummy via conductors 8 formed in a thickness direction of the substrate body 2 are disposed at an outside of the mounting region 5 in the plan view, the mounting region 5 and the multiple dummy via conductors 8 are included on the surface 3 of the substrate body 2 in the plan view, and a recess 10 protruding to a rear 4 side of the substrate body 2 in a side view is provided.SELECTED DRAWING: Figure 1
Inventors:
HAYASHI TAKAHIRO
Application Number:
JP2017203016A
Publication Date:
May 23, 2019
Filing Date:
October 20, 2017
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
H05K1/02; H05K3/34; H05K3/46
Domestic Patent References:
| JP2017017081A | 2017-01-19 | |||
| JP2004288660A | 2004-10-14 | |||
| JP2004103607A | 2004-04-02 | |||
| JP2012114183A | 2012-06-14 | |||
| JP2007234662A | 2007-09-13 | |||
| JPH05267392A | 1993-10-15 |
Foreign References:
| WO2015102107A1 | 2015-07-09 |
Attorney, Agent or Firm:
Suzuki Manabu