Title:
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2020065085
Kind Code:
A
Abstract:
To provide a component mounting device and a component mounting method capable of correcting a coating material, applied to a board, with high accuracy.SOLUTION: A component mounting device includes a movable head capable of loading a suction nozzle for sucking a component and loading onto a board, and coating nozzle for discharging a coating material to the board, exchangeably and movable relatively to the board, a nozzle holding device for holding the suction nozzle and the coating nozzle exchangeably between the movable head, and a nozzle exchange control section for controlling exchange of the suction nozzle and the coating nozzle in the movable head. Upon completion of coating of the board with the coating material by means of the coating nozzle, the nozzle exchange control section controls to exchange the coating nozzle, loaded to the movable head, for the suction nozzle, held by the nozzle holding device, and to load the component on the coating material applied to the board by means of the suction nozzle loaded to the movable head.SELECTED DRAWING: Figure 9
Inventors:
MOTAI MICHIAKI
Application Number:
JP2020008807A
Publication Date:
April 23, 2020
Filing Date:
January 23, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H05K13/04
Domestic Patent References:
| JPH07265771A | 1995-10-17 |
Foreign References:
| WO2015068305A1 | 2015-05-14 |
Attorney, Agent or Firm:
Kenji Kamada
Koichi Nomura
Koichi Nomura