Title:
DIALLYL PHTHALATE RESIN MOLDING MATERIAL AND ELECTRONIC/ELECTRIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2020152759
Kind Code:
A
Abstract:
To provide a diallyl phthalate resin composition material which is excellent in tracking resistance and flatness of a thin molding.SOLUTION: A diallyl phthalate resin composition material is a diallyl phthalate resin composition material used for forming an insulating sheet sandwiched between two plate-like conductive bodies, contains a diallyl phthalate prepolymer, a diallyl phthalate monomer and a filler, and has a flow length measured by a rectangular flow channel of 60 mm or more and 200 mm or less.SELECTED DRAWING: None
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Inventors:
SUZUKI TOMOHARU
Application Number:
JP2019050097A
Publication Date:
September 24, 2020
Filing Date:
March 18, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L31/08; B29C45/00; C08F2/00; C08F2/44; C08F263/08; C08K5/14; C08K7/02; H01B3/20
Domestic Patent References:
| JP2004231771A | 2004-08-19 | |||
| JP2009256671A | 2009-11-05 | |||
| JPS52147672A | 1977-12-08 | |||
| JPS6037104A | 1985-02-26 | |||
| JP2002194166A | 2002-07-10 | |||
| JP2013010883A | 2013-01-17 | |||
| JPS58191750A | 1983-11-09 | |||
| JPS60219233A | 1985-11-01 |
Attorney, Agent or Firm:
Shinji Hayami
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