Title:
SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND SOLDER JOINT USING THEM
Document Type and Number:
Japanese Patent JP2020192600
Kind Code:
A
Abstract:
To provide a solder alloy, solder powder and the like which suppress changes with time of a solder paste, are excellent in wettability, have a small temperature difference between a liquidus line temperature and a solidus line temperature, have high mechanical characteristics and exhibit a high joint strength.SOLUTION: A solder alloy has an alloy composition of at least one of 0.55-0.75 mass% Cu, 0.0350-0.0600 mass% Ni, 0.0035-0.0200 mass% Ge, 25-300 mass% ppm As, 0-3,000 mass ppm Sb, 0-10,000 mass ppm Bi, and 0-5,100 mass ppm Pb, and the balance Sn, and satisfies Expression (1): 275≤2As+Sb+Bi+Pb and Expression (2): 0.01≤(2As+Sb)/(Bi+Pb)≤10.00, in Expressions (1) and (2), As, Sb, Bi and Pb each satisfy a content (mass ppm) in the alloy composition.SELECTED DRAWING: None
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Inventors:
KAWASAKI HIROYOSHI
MUNAKATA OSAMU
SHIRATORI MASATO
MUNAKATA OSAMU
SHIRATORI MASATO
Application Number:
JP2019238023A
Publication Date:
December 03, 2020
Filing Date:
December 27, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02
Attorney, Agent or Firm:
Hideki