Title:
LOCAL SOLDERING NOZZLE AND LOCAL SOLDERING DEVICE
Document Type and Number:
Japanese Patent JP2021053703
Kind Code:
A
Abstract:
To provide a local soldering nozzle capable of performing good soldering even to a thick printed circuit board with a simple configuration, in a local soldering device that uses the nozzle to upwardly eject molten solder stored in a solder bath and solders it to a through hole provided in the printed circuit board; and to also provide the local soldering device using the local soldering nozzle.SOLUTION: The local soldering nozzle comprises a tubular nozzle portion and a protruding portion. In the nozzle portion, molten solder flows in from an inflow port formed at one end, and the molten solder flows out from a jet port formed at the other end. The protruding portion is provided at the other end of the nozzle portion, and has an end face portion that protrudes from the nozzle portion in a radial direction of the jet port.SELECTED DRAWING: Figure 1
Inventors:
IWAKI MASANORI
Application Number:
JP2020161156A
Publication Date:
April 08, 2021
Filing Date:
September 25, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B23K1/08; H05K3/34
Attorney, Agent or Firm:
Kanako Murakami
Shigeaki Matsui
Kuratani Yasutaka
Shigeaki Matsui
Kuratani Yasutaka