Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
Japanese Patent JP2021076743
Kind Code:
A
Abstract:
To provide a photosensitive resin composition that can form a resist pattern having reduced dielectric constants as an insulation film.SOLUTION: A photosensitive resin composition contains (A) component: a copolymer having a structure in which a polyphenylene ether unit and a polybutadiene unit are bonded via an ester bond.SELECTED DRAWING: None
Inventors:
YOKOCHI SEIGO
YOSHIDA TETSUYA
YOSHIDA TETSUYA
Application Number:
JP2019204062A
Publication Date:
May 20, 2021
Filing Date:
November 11, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
G03F7/032; G03F7/004; G03F7/027; G03F7/038; H05K3/28
Domestic Patent References:
| JP2019182989A | 2019-10-24 | |||
| JP2021028699A | 2021-02-25 | |||
| JP2012122046A | 2012-06-28 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano