Title:
POLISHING PAD AND POLISHING PAD MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2021137892
Kind Code:
A
Abstract:
To provide a polishing pad in which slurry and polishing chips intruding into a through-hole provided to optically detect a surface condition of an object to be polished can be exhausted to the outside of the through-hole.SOLUTION: A polishing pad 1 is provided which includes: a first layer 2 having a polishing surface for polishing an object to be polished; a transparent sheet layer 4 adhered to a surface, at the opposite side of the polishing surface, of the first layer 2; and a second layer 3 adhered to a surface, at the other side of the surface adhere to the first layer 2, of the transparent sheet 4. The first layer 2 has a first through-hole 5, and the second layer 3 has a second through-hole. The first through-hole 5 and the second through-hole overlap with each other at least partially when viewing the polishing pad 1 through the polishing surface side. The first later 2 includes a plurality of air bubbles and at least some of the plurality of air bubbles are continuous air bubbles in which air bubbles are linked and communicated with each other.SELECTED DRAWING: Figure 3
Inventors:
TAKAGI MASATAKA
TATENO TEPPEI
TANAKA KEISUKE
TATENO TEPPEI
TANAKA KEISUKE
Application Number:
JP2020035682A
Publication Date:
September 16, 2021
Filing Date:
March 03, 2020
Export Citation:
Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/22; B24B37/013; B24B37/24; B24B37/26; H01L21/304
Attorney, Agent or Firm:
Shinichiro Tanaka
▲吉▼田 和彦
Hiroyuki Suda
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori
Yasushi Sasaki
▲吉▼田 和彦
Hiroyuki Suda
Kazuo Yamazaki
Satsuki Ichikawa
Hironobu Hattori
Yasushi Sasaki