【発明の名称】半導体装置 - TOKYO SHIBAURA ELECTRIC CO

Title:

【発明の名称】半導体装置

Document Type and Number:

Japanese Patent JP2504609

Kind Code:

B2

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Inventors:

FUJIWARA TAKASHI
MATSUDA HIDEO
HYOSHI MICHIAKI
SUZUKI HISASHI

Application Number:

JP18173390A

Publication Date:

June 05, 1996

Filing Date:

July 10, 1990

Export Citation:

Assignee:

TOKYO SHIBAURA ELECTRIC CO

International Classes:

H01L29/744; H01L29/08; H01L29/739; H01L29/74; (IPC1-7): H01L29/744; H01L29/74

Domestic Patent References:

Attorney, Agent or Firm:

Takehiko Suzue (3 outside)

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