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Title:
【考案の名称】半導体デバイスの電極部構造
Document Type and Number:
Japanese Patent JP2531130
Kind Code:
Y2
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Inventors:
Takashi Nariya
Shigeru Saito
Application Number:
JP1831190U
Publication Date:
April 02, 1997
Filing Date:
February 27, 1990
Export Citation:
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Assignee:
Fujitsu Ten Co., Ltd.
International Classes:
H01L23/50; (IPC1-7): H01L23/50
Domestic Patent References:
JP5837943A
JP60149143U
Attorney, Agent or Firm:
Aoki Akira (4 outside)



 
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