Title:
SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND PROJECTION MANUFACTURING DEVICE THEREOF
Document Type and Number:
Japanese Patent JP3728918
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate, wherein a protruding part is easily allocated at a connection part of an input/output part of the substrate with no missing of conductive balls.
SOLUTION: For the method for manufacturing substrate, a process where one end of a metal wire 6 is inserted into a through-hole 4 of a substrate 1 comprising the through-hole and a wiring terminal 5, for protrusion above the other surface of the substrate, and a ball 7 is formed at a tip part of the metal wire, a process in which a specified part on one surface side of the metal wire is connected to the wiring terminal 5, and a process where an excessive metal wire is cut and removed, are performed in this order.
Inventors:
Hidekazu Sato
Application Number:
JP7814698A
Publication Date:
December 21, 2005
Filing Date:
March 25, 1998
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H01L23/12; H01L21/60; H01L23/50; (IPC1-7): H01L23/12
Domestic Patent References:
| JP2102738U | ||||
| JP8107162A | ||||
| JP1051109A | ||||
| JP5206357A | ||||
| JP9134982A |
Attorney, Agent or Firm:
Masahiko Ueyanagi
Osamu Suzawa
Osamu Suzawa
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