Title:
【発明の名称】ワイヤボンディング方法
Document Type and Number:
Japanese Patent JP2555120
Kind Code:
B2
Abstract:
PURPOSE:To avoid the generation of resonance state, by proving a control mechanism to perform bonding the wire of a pad and bonding the wire to a lead, with different oscillation frequencies, or different oscillation powers necessary to each bonding. CONSTITUTION:A first ultrasonic oscillator 13a and a second ultrasonic oscillator 13b are provided which are switched by a switching mechanism 20 controlled by a controlling part 18. The oscillation frequency can be changed for a first bonding of a pellet 5 to a pad 5a and for a second bonding to a lead 72. Therefore bonding failure due to resonance of the lead 72 can be be prevented.
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Inventors:
ISHII YASUSHI
NOZAWA HIFUMI
OOSHIMA YOSHIO
NOZAWA HIFUMI
OOSHIMA YOSHIO
Application Number:
JP560988A
Publication Date:
November 20, 1996
Filing Date:
January 13, 1988
Export Citation:
Assignee:
HITACHI SEISAKUSHO KK
HITACHI TOKYO EREKUTORONIKUSU KK
HITACHI TOKYO EREKUTORONIKUSU KK
International Classes:
H01L21/603; H01L21/60; H01L21/607; (IPC1-7): H01L21/60; H01L21/607
Domestic Patent References:
| JP57109348A | ||||
| JP62154748A |
Attorney, Agent or Firm:
Yamato Tsutsui