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Title:
【発明の名称】フレキシブル回路基板及びその製造方法
Document Type and Number:
Japanese Patent JP2665134
Kind Code:
B2
Abstract:
A flexible circuit board device for connecting to an electronic device comprised of a flexible circuit board made from flexible resistive film, an adhesive layer formed on the flexible resistive film, electrical conductive circuits formed on the adhesive layer and cured films filling the gaps between the conductive circuits. The electrical conductive circuits are formed of conductor metal foil and a plating film covering the surface of the conductor.

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Inventors:
Murata Katsuhiro
Mitsumasa Shibata
Toru Hatakeyama
Tadaaki Isono
Application Number:
JP22004393A
Publication Date:
October 22, 1997
Filing Date:
September 03, 1993
Export Citation:
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Assignee:
Nippon Graphite Industry Co., Ltd.
International Classes:
H01B5/14; H01B13/00; H01R11/00; H01R43/00; H05K3/28; H05K3/36; H05K1/00; H05K3/24; H05K3/32; H05K3/34; H05K3/38; (IPC1-7): H01B5/14; H01B13/00; H01R11/00; H01R43/00
Domestic Patent References:
JP2128837A
JP6394700A
JP413789A
JP61162962U
JP62116462U
JP6010277U
JP6421919U
JP340453B2
Attorney, Agent or Firm:
Akihide Sugimura (5 outside)



 
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