Title:
金属ナノワイヤ層が形成された基材及びその製造方法
Document Type and Number:
Japanese Patent JP6956706
Kind Code:
B2
Abstract:
Provided is a substrate having a metal nanowire layer formed thereon, the metal nanowire layer having high durability against migration or sulfurization/oxidation and high mechanical strength, wherein some of the metal nanowires are embedded in a flexible substrate by forming the metal nanowire layer on the substrate and applying external energy, and some or all of the exposed metal nanowires are plated.
Inventors:
Teppei Araki
Takeshi Sekiya
Katsuaki Suganuma
Sake money
Hideki Orai
Hiroyuki Uchida
Masanao Hara
Eri Nakazawa
Takeshi Sekiya
Katsuaki Suganuma
Sake money
Hideki Orai
Hiroyuki Uchida
Masanao Hara
Eri Nakazawa
Application Number:
JP2018505962A
Publication Date:
November 02, 2021
Filing Date:
March 14, 2017
Export Citation:
Assignee:
National University Corporation Osaka University
SHOWA DENKO K.K.
SHOWA DENKO K.K.
International Classes:
H01B5/14; B32B5/16; B32B15/02; B32B15/08; B82Y30/00; C23C18/31; H01B1/00; H01B1/02; H01B13/00
Domestic Patent References:
| JP2012527071A | ||||
| JP5151825A | ||||
| JP2013522814A | ||||
| JP2016509332A |
Attorney, Agent or Firm:
Motoji Aihara