Title:
【発明の名称】ボンディング用金合金細線
Document Type and Number:
Japanese Patent JP2782082
Kind Code:
B2
Abstract:
PURPOSE:To obtain the gold alloy thin wire for bonding having excellent heat resistance and drastically reduced vibration fracture rate by adding specified amounts of Y, Ca, Be and Ag to high purity gold. CONSTITUTION:By weight, 3 to 100 ppm Y, 1 to 50ppm Ca, 1 to 10ppm Be as well as 5 to 110ppm Y+Ca+Be and furthermore 5 to 100ppm Ag are added to high purity gold. As the above high purity gold, the one contg. gold of about >=99.99wt.% purity and the balance inevitable impurities is preferably used. The above addition of Y, Ca and Be give strains to the crystal lattices of gold to increase the recrystallization temp., by which the strength at an ordinary temp. and heat resistance can be improved. Furthermore, the addition of Ag improves the toughness. In this way, the gold alloy thin wire in which mechanical characteristics at an ordinary temp., loop height, ball shape, etc., are suitably maintainable and having low vibration fracture rate can be obtd.
Inventors:
Kenji Mori
Masanori Tokita
Fukuda Takanori
Eiichi Fujimoto
Masanori Tokita
Fukuda Takanori
Eiichi Fujimoto
Application Number:
JP8260689A
Publication Date:
July 30, 1998
Filing Date:
March 31, 1989
Export Citation:
Assignee:
Tatsuta Electric Wire Co., Ltd.
International Classes:
C22C5/02; H01L21/60; (IPC1-7): C22C5/02; H01L21/60
Attorney, Agent or Firm:
Hideo Fujimoto