Title:
【発明の名称】半導体集積回路装置の配線方法
Document Type and Number:
Japanese Patent JP2803800
Kind Code:
B2
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Inventors:
Hiroyo Kuroda
Yuko Mitsuyasu
Yuko Mitsuyasu
Application Number:
JP8383791A
Publication Date:
September 24, 1998
Filing Date:
April 16, 1991
Export Citation:
Assignee:
Matsushita Electronics Industrial Co., Ltd.
International Classes:
H01L21/82; H01L21/822; H01L27/04; (IPC1-7): H01L21/82
Domestic Patent References:
| JP6482546A | ||||
| JP63278249A | ||||
| JP1241144A | ||||
| JP3255665A |
Attorney, Agent or Firm:
Tomoyuki Takimoto (1 person outside)