Title:
【発明の名称】冷却モジュール
Document Type and Number:
Japanese Patent JP2819807
Kind Code:
B2
Abstract:
PURPOSE:To enhance cooling performance of a cooling module by coolant by providing a returning route with members forming side walls that partition adjacent electronic parts so as to protect bubbles produced by boiling of coolant. CONSTITUTION:On a returning route 6 formed between a cooling plate 1 fixed by a metal fitting 11 and a base plate 3, members 7 having side walls 7A are installed. Further, the members 7 are so formed that all sides of electronic parts 4 mounted to a base plate 3 are surrounded by side walls 7A in order to protect bubbles of coolant 5 flowing in the feedback route 6 from approaching adjacent electronic parts 4. Then, coolant 5 supplied to a supply port 1A as shown by arrow A1 is supplied to each nozzle 2 through a supply route 1D as shown by arrow A2, and as shown by arrow A3, when coolant 5 is jetted to outer periphery 4B of electronic parts 4, bubbles 10 in the coolant 5 made to boil by the jetting rise along side walls 7A, respectively, flow in the feedback route, are sent out to a feedback exit 1B, and are discharged as shown by arrow A4.
Inventors:
Nobuyoshi Yamaoka
Application Number:
JP23391290A
Publication Date:
November 05, 1998
Filing Date:
September 03, 1990
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K7/20; H01L23/44; H01L23/473; (IPC1-7): H01L23/44; H05K7/20
Domestic Patent References:
| JP3184365A | ||||
| JP461259A | ||||
| JP361352U | ||||
| JP361351U | ||||
| JP62126844U | ||||
| JP3113843U |
Attorney, Agent or Firm:
Teiichi