Title:
【発明の名称】半導体装置及びその製造方法
Document Type and Number:
Japanese Patent JP2819808
Kind Code:
B2
Inventors:
Hiroshi Maeda
Tetsuo Fujii
Tetsuo Fujii
Application Number:
JP23542290A
Publication Date:
November 05, 1998
Filing Date:
September 04, 1990
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H01L27/08; H01L21/322; H01L21/336; H01L29/78; H01L29/786; (IPC1-7): H01L29/786; H01L21/322; H01L21/336
Attorney, Agent or Firm:
Hironobu Onda (1 person outside)