Title:
【発明の名称】半導体装置
Document Type and Number:
Japanese Patent JP2850639
Kind Code:
B2
Inventors:
SUZUKI HIDEKI
Application Number:
JP12700092A
Publication Date:
January 27, 1999
Filing Date:
May 20, 1992
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L29/73; H01L21/331; H01L29/732; (IPC1-7): H01L21/331; H01L29/73
Domestic Patent References:
| JP2304932A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)