Title:
【発明の名称】混成集積回路装置
Document Type and Number:
Japanese Patent JP2850640
Kind Code:
B2
Abstract:
A hybrid integrated circuit having a lead frame electrically connected to electronic components by means of a silver (Ag) paste, the hybrid integrated circuit comprising: an electroless-plated coating on the lead frame, the coating being free from an insulating surface oxide layer at least in a connection area in which the electrical connection is provided. A process of producing this hybrid integrated circuit comprises: a first step of electroless-plating a lead frame by using a phosphorus-containing reducing agent to form a coating on the lead frame; a second step of mounting electronic components on the lead frame and then electrically and mechanically connecting the former to the latter by means of an electroconductive paste; and a third step of maintaining the surface of the electroless-plated coating free from a phosphorus-containing oxide layer during the connecting operation.
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Inventors:
SUZUKI YASUTOSHI
AO KENICHI
NARITA RYOICHI
YOSHINO YOSHI
OOMI JUJI
AO KENICHI
NARITA RYOICHI
YOSHINO YOSHI
OOMI JUJI
Application Number:
JP13771292A
Publication Date:
January 27, 1999
Filing Date:
April 28, 1992
Export Citation:
Assignee:
DENSOO KK
International Classes:
C23C18/16; H01G4/228; H01L21/00; H01L23/50; H01L25/00; H01L25/16; H05K3/32; H05K3/34; H05K1/02; H05K1/18; H05K3/20; H05K3/24; (IPC1-7): H01L23/50; H01L25/00
Domestic Patent References:
| JP1109756A | ||||
| JP236588A | ||||
| JP2146864U |
Attorney, Agent or Firm:
Hirohiko Usui