Title:
【発明の名称】半導体装置の製造方法および製造装置
Document Type and Number:
Japanese Patent JP2850641
Kind Code:
B2
Inventors:
YOKOYAMA NAOMI
TSUCHA YASUSHI
YAMAMOTO KANEHISA
TSUCHA YASUSHI
YAMAMOTO KANEHISA
Application Number:
JP14124592A
Publication Date:
January 27, 1999
Filing Date:
June 02, 1992
Export Citation:
Assignee:
MITSUBISHI DENKI KK
International Classes:
G01B11/24; G05D3/12; G06T1/00; G06T7/00; G06T7/60; H01L21/66; H01L21/68; H04N7/18; (IPC1-7): G01B11/24; G05D3/12; H01L21/66; H01L21/68; H04N7/18
Domestic Patent References:
| JP4279808A | ||||
| JP56422A | ||||
| JP4278409A | ||||
| JP554126A | ||||
| JP6476284A | ||||
| JP2310777A | ||||
| JP3232070A | ||||
| JP465605A |
Attorney, Agent or Firm:
Kaneo Miyata (2 outside)