Title:
【発明の名称】耐破袋性に優れたポリアミド積層体袋およびその製法
Document Type and Number:
Japanese Patent JP2996164
Kind Code:
B2
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| WO/1998/037139 | HEAT SEALABLE FILMS |
| JP2001131316 | ANTIFOGGING THERMOPLASTIC TRANSPARENT RESIN SHEET AND ITS MOLDED MATERIAL |
Inventors:
Toshihiro Yamashita
Tsutomu Isaka
Tsutomu Isaka
Application Number:
JP512796A
Publication Date:
December 27, 1999
Filing Date:
January 16, 1996
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
B65D65/40; B32B27/34; (IPC1-7): B32B27/34; B65D65/40
Domestic Patent References:
| JP1244847A | ||||
| JP5979732A |
Attorney, Agent or Firm:
Ueki Kuichi