Title:
【発明の名称】半導体集積回路
Document Type and Number:
Japanese Patent JP3012310
Kind Code:
B2
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Inventors:
Shozo Kawabata
Shuhei Yamaguchi
Hiroaki Ukai
Shuhei Yamaguchi
Hiroaki Ukai
Application Number:
JP30763390A
Publication Date:
February 21, 2000
Filing Date:
November 14, 1990
Export Citation:
Assignee:
富士通株式会社
富士通ヴィエルエスアイ株式会社
富士通ヴィエルエスアイ株式会社
International Classes:
G11C11/416; H03K19/086; (IPC1-7): G11C11/416; H03K19/086
Attorney, Agent or Firm:
Hironobu Onda