Title:
【発明の名称】マルチチップ・モジュールの製造方法
Document Type and Number:
Japanese Patent JP3091214
Kind Code:
B2
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Inventors:
Yoshihiko Okamoto
Hideyuki Yamada
Hideyuki Yamada
Application Number:
JP30925990A
Publication Date:
September 25, 2000
Filing Date:
November 15, 1990
Export Citation:
Assignee:
株式会社日立製作所
株式会社日立インフォメーションテクノロジー
株式会社日立インフォメーションテクノロジー
International Classes:
H01L21/3205; H01L21/66; H01L21/822; H01L23/12; H01L23/52; H01L23/522; H01L23/538; H01L25/04; H01L25/18; H01L27/04; (IPC1-7): H01L23/522; H01L25/04; H01L25/18
Domestic Patent References:
| JP63258055A | ||||
| JP63276236A | ||||
| JP2165662A | ||||
| JP1143248A | ||||
| JP1135740U | ||||
| JP312450U |
Attorney, Agent or Firm:
Yamato Tsutsui